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DATA SHEET
MOS INTEGRATED CIRCUIT
PD168001
MONOLITHIC 4-CHANNEL H BRIDGE + LOW-SIDE SWITCH
DESCRIPTION
The PD168001 is a monolithic 4-channel H bridge driver and low-side switch IC that uses a power MOSFET at the output stage. Because of the MOSFET at the output stage, both the inputs and outputs are interfaced by PWM digital signals, and the power consumption can therefore be lowered. A 30-pin thin shrink SOP is employed as the package to help to create a small and thin set.
FEATURES
O Four H bridge circuits using power MOSFET and low-side switch O Low on-resistance 4-ch H bridge: 2 MAX. (sum of upper and lower stages) Low-side switch: 2 MAX. O High-speed PWM drive: Operating frequency up to 120 kHz O Thin 30-pin shrink SOP (7.62 mm (300) with 0.65 mm pitch)
ORDERING INFORMATION
Part Number PD168001MC-6A4-A Package 30-pin plastic TSSOP (7.62 mm (300))
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. S15728EJ1V0DS00 (1st edition) Date Published March 2003 N CP(K) Printed in Japan
(c)
PD168001
BLOCK DIAGRAM
SEL 2 VDD 1 (9,13,18,22) VM IN1A IN1B 3 4 Controller 1 H bridge 1 23 OUT1B
8
OUT1A
IN2A IN2B
5 6 Controller 2 H bridge 2
10 21
OUT2A OUT2B
IN3A IN3B
30 29 Controller 3 H bridge 3
12 19
OUT3A OUT3B
IN4A IN4B
28 27 Controller 4 H bridge 4
14 17
OUT4A OUT4B
IN5
26 Controller 5
25
OUT5
GND (7,11,15,16,20,24)
2
Data Sheet S15728EJ1V0DS
PD168001
PIN CONFIGURATION
Package: 30-pin TSSOP (7.62 mm with 0.65 mm pitch)
VDD SEL IN1A IN1B IN2A IN2B GND OUT1A VM OUT2A GND OUT3A VM OUT4A GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
IN3A IN3B IN4A IN4B IN5 OUT5 GND OUT1B VM OUT2B GND OUT3B VM OUT4B GND
Data Sheet S15728EJ1V0DS
3
PD168001
PIN FUNCTION
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Pin Name VDD SEL IN1A IN1B IN2A IN2B GND OUT1A VM OUT2A GND OUT3A VM OUT4A GND GND OUT4B VM OUT3B GND OUT2B VM OUT1B GND OUT5 IN5 IN4B IN4A IN3B IN3A Logic power supply Control pin Channel 1 input pin A Channel 1 input pin B Channel 2 input pin A Channel 2 input pin B GND pin Channel 1 output pin A Motor power supply pin Channel 2 output pin A GND pin Channel 3 output pin A Motor power supply pin Channel 4 output pin A GND pin GND pin Channel 4 output pin B Motor power supply pin Channel 3 output pin B GND pin Channel 2 output pin B Motor power supply pin Channel 1 output pin B GND pin Channel 5 output pin Channel 5 input pin Channel 4 input pin B Channel 4 input pin A Channel 3 input pin B Channel 3 input pin A Pin Function
4
Data Sheet S15728EJ1V0DS
PD168001
FUNCTION SPECIFICATIONS
(1) Revolution control A high-level/low-level binary signal is input to the H bridge driver block incorporating 4 outputs. The truth table of the input logic is shown below.
VM VDD
IN1A to 4A OUT1A to 4A IN1B to 4B OUT1B to 4B SEL
Function Table (Common to All Channels) Input IN1A to IN4A L H L H - IN1B to IN4B L L H H - SEL H H H H L 1A to 4A L H L H Hi-Z Output 1B to 4B L L H H Hi-Z
Data Sheet S15728EJ1V0DS
5
PD168001
(2) Switching of H bridges When output A is switched in the figure shown on the right, a dead time (time for which both Pch and Nch are OFF) elapses to prevent through current. Consequently, the waveform of output A (rise time, fall time, and delay time) changes depending on whether output B is fixed to the high or low level. The figure below shows the voltage waveform of output B in response to an input waveform when output B is fixed to the low level and the high level.
A B Pch VM Pch
Nch
Nch
Rise delay time (tTLH)
Fall delay time (tTHL)
Input A waveform
Dead time Output A when output B is fixed to low level Rise time (tTLH) Fall time (tTHL)
Output A when output B is fixed to low level
Dead time
* When output B is fixed to low level Output A goes into a high-impedance state and is undefined during the dead time period, but a low level is output to output A because output B is pulled down by the load * When output B is fixed to high level Output A goes into a high-impedance state and is undefined during the dead time period, but a high level is output to output A because output B is pulled up by the load.
6
Data Sheet S15728EJ1V0DS
PD168001
(3) Low-side switch The low-side switch of ch 5 has an output stage configured of an N-ch MOSFET. Its input is a high-level/low-level binary signal. The truth table of the input logic is shown below.
VM VDD
M
IN5
SEL
Function Table (Channel 5) Input IN5 L H - SEL H H L Output OUT5 Hi-Z (output off) L (ouput on) Hi-Z (output off)
(4) Power sequence This IC has logic power supply (VDD) and output power supply (VM) pins. The power sequence of these pins must be as follows. Turn on VM with VDD turned on to turn on power. To turn off power, turn off VM with VDD turned on, and then turn off VDD. (However, VDD and VM can be turned off at the same time.)
Cautions 1. Because this IC switches a high current at high speeds, surge may be generated by VM, GND wiring, and inductance, degrading the IC. On the PWB, widen and shorten the pattern width of the GND lines as much as possible, and locate bypass capacitors between VM and GND as close to the IC as possible. Connect two capacitors in parallel: a magnetic capacitor with a low inductance (4700 pF or more) and an electrolytic capacitor of 10 F or more, depending on the load current. 2. When a load such as a DC motor is connected to ch 5 and the switch is turned OFF, a counter electromotive force is generated. If the absolute maximum rating of the output pin voltage may be exceeded by the voltage applied to the load, be sure to connect a Schottky barrier diode to both the ends of the load to prevent the rating of the output pin voltage from being exceeded.
Data Sheet S15728EJ1V0DS
7
PD168001
ABSOLUTE MAXIMUM RATINGS (TA = 25C)
Parameter Power supply voltage Symbol VDD VM Input voltage Output pin voltage DC output current Instantaneous output current
Note 1
Conditions Control block Motor block
Rating -0.5 to +6.0 -0.5 to +6.0 -0.5 to VDD+0.5 6.0
Unit V V V V A/ch A/ch W C C
VIN VOUT IDD IDP DC When two or more channels are turned ON at the same time PW 50 ms, Duty 5%
0.3 1.0 1.0 150 -55 to 150
Power consumptionNote 2 Peak junction temperature Storage temperature
PT TCH(MAX) Tstg
Notes 1. DUTY indicates the period during which a current flows, exceeding IDD for the entire sequence 2. When mounted on a glass epoxy board (100 mm x 100 mm x 1 mm, with a copper foil area of 15%)
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage Symbol VDD VMACT Input voltage DC output current Instantaneous output current VIN IDD IDP DC When two or more channels are turned ON at the same time PW 50 ms, Duty 5% Conditions Control block Motor block MIN. 3.0 4.5 0 TYP. 3.3 5.0 MAX. 3.6 5.5 VDD 0.2 0.85 Unit V V V A/ch A/ch
Operating frequency Operating temperature range
fIN TA 0
120 75
kHz C
8
Data Sheet S15728EJ1V0DS
PD168001
ELECTRICAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED, VDD = 3.3 V, VM = 5 V, TA = 25C) Parameter 1. DC characteristics VM pin current VDD pin current Input pull-down resistance High-level input voltage Low-level input voltage High-level input current Low-level input current On-resistance (ch1 to 4, sum of upper and lower stages) On-resistance (ch 5) Switching current with no load on H Note bridge 2. AC characteristics With output of one side fixed to low With output of one side fixed to high Rise delay time Rise time Fall time tTHL1 Fall delay time Rise time Fall time tTHL2 tTLH3 tTHL3 tTHL tTHL2 Load: 20 Input frequency: 1 kHz 35 150 35 35 75 500 75 300 100 50 150 800 150 600 200 100 tTLH tTLH1 150 35 400 250 800 500 IM IDZ(OFF) RIN VIH VIL IIH IIL RON RON IS(AVE) SEL = L SEL = L IN and SEL pins IN and SEL pins IN and SEL pins VIN = VDD VIN = 0 V ID = 0.2 A ID = 0.2 A Input frequency: 100 kHz -2.0 2.0 2.0 4.5 50 0.7 x VDD -0.3 10 10 200 VDD 0.3 x VDD 80 Symbol Conditions MIN. TYP. MAX. Unit
A A
k V V
A A
mA
1 to 4ch
ns
5ch
Rise time Fall time
Note Average value of current consumed inside the H bridge when the switching operation is performed without a load.
Data Sheet S15728EJ1V0DS
9
PD168001
TIMING CHARTS
* Channel 1 to Channel 4
When output B is fixed to low level
50% Input waveform at A
50%
Rise delay time tTLH
Fall delay time
90% 50% Voltage wavefrom at A 10% Rise time tTLH1
90% 50% 10% Fall time tTHL1
When output B is fixed to high level
50% Input waveform at A
50%
Rise delay time
Fall delay time tTHL
90%
90% 50% 10%
Voltage wavefrom at A
50% 10% Rise time tTLH2
Fall time tTHL2
* Channel 5
Input waveform
90%
90%
Output waveform 10% Rise time tTLH3 Rise time tTLH3 10%
10
Data Sheet S15728EJ1V0DS
PD168001
POWER CONSUMPTION CHARACTERISTICS
PT-TA Characteristics 1.4 100 mm x 100 mm x 1.0 mm when mounted on a glass epoxy board
1.2 25C
Power consumption PT (W)
1.0
1.0 W
125C/W 0.8
0.6
0.4
0.2 75C 0 -20 0 25 50 75 100 125 150
Ambient Temperature TA (C)
Data Sheet S15728EJ1V0DS
11
PD168001
IDZ (OFF) -TA Characteristics 1
VDD Current IDZ (OFF) ( A) VDD Current IDZ (OFF) ( A)
IDZ (OFF) -VDD Characteristics 1 TA = 25C 0.8 0.6 0.4 0.2 0 2.8
VDD = 3.6 V 0.8 0.6 0.4 0.2 0 -10
0
10
20
30
40
50
60
70
80
3
3.2
3.4
3.6
3.8
Ambient Temperature TA (C)
Supply Voltage VDD (V)
RON1, RON2 Characteristics
On Resistance RON1, RON2 () On Resistance RON1, RON2 ()
RON1, RON2-VM Characteristics 2 TA = 25C 1.5 RON1 1 RON2
2 VDD = 3.6 V 1.5 RON1 1 RON2
0.5
0.5
0 -10
0
10
20
30
40
50
60
70
80
0 4.4
4.6
4.8
5
5.2
5.4
5.6
Ambient Temperature TA (C)
Supply Voltage TM (V)
RIN-TA Characteristics
Input pull-down Resistance RIN () Input pull-down Resistance RIN ()
RIN-VDD Characteristics 150 TA = 25C 140 130 120 110 100 2.8
150 VDD = 3.6 V 140 130 120 110 100 -10
0
10
20
30
40
50
60
70
80
3
3.2
3.4
3.6
3.8
Ambient Temperature TA (C)
Supply Voltage VDD (V)
12
Data Sheet S15728EJ1V0DS
PD168001
VIH, VIL-TA Characteristics
Hi/Low Level Input Voltage VIH, VIL (V)
VIH, VIL-VDD Characteristics
Hi/Low Level Input Voltage VIH, VIL (V)
3 VDD = 3.6 V 2.5 2 VIH 1.5 1 0.5 0 -10 0 10 20 30 40 50 60 70 80 VIL
3 TA = 25C 2.5 2 1.5 1 0.5 0 2.8 3 3.2 3.4 3.6 3.8 VIH VIL
Ambient Temperature TA (C)
Supply Voltage TDD (V)
Rising/Falling Delay Time tTLH, tTHL (ns)
tTLH, tTHL-TA Characteristics
Rising/Falling Time tTLH1, tTHL1 (ns)
tTLH1, tTHL1-TA Characteristics 400 VDD = 3.6 V 300 tTLH1 200
800 VDD = 3.6 V 600 tTHL 400 tTLH
200 0 -10
100 tTHL1 0 -10 0 10 20 30 40 50 60 70 80
0
10
20
30
40
50
60
70
80
Ambient Temperature TA (C)
Ambient Temperature TA (C)
tTLH2, tTHL2-TA Characteristics
Rising/Falling Time tTLH2, tTHL2 (ns)
tTLH3, tTHL3-TA Characteristics
Rising/Falling Time tTLH2, tTHL2 (ns)
500 VDD = 3.6 V 400 tTHL2 300 200 100 0 -10 tTLH2
200 VDD = 3.6 V 150
100 tTLH3 50 tTHL3 0 -10 0 10 20 30 40 50 60 70 80
0
10
20
30
40
50
60
70
80
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Data Sheet S15728EJ1V0DS
13
PD168001
PACKAGE DRAWING
30-PIN PLASTIC TSSOP (7.62mm(300))
30 16 F G T detail of lead end
P L 1 15 U E
A A' S
H I J
C D M
M
N B K
S
NOTE
Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
ITEM A A' B C D E F G H I J K L M N P T U
MILLIMETERS 9.850.10 9.70.1 0.375 0.65 (T.P.) 0.240.05 0.10.05 1.2 MAX. 1.00.05 8.10.1 6.10.1 1.00.1 0.1450.025 0.5 0.10 0.10 +5 3 -3 0.25 0.60.15 S30MC-65-6A4
14
Data Sheet S15728EJ1V0DS
PD168001
RECOMMENDED SOLDERING CONDITIONS
The PD168001 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
PD168001MC-6A4-A 30pin plastic TSSOP (7.62mm (300))
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 260C, Time: 60 seconds max. (at 220C or higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended Caution Do not use different soldering methods together (except for partial heating). Recommended Condition Symbol IR60-00-3
Data Sheet S15728EJ1V0DS
15
PD168001
[MEMO]
16
Data Sheet S15728EJ1V0DS
PD168001
[MEMO]
Data Sheet S15728EJ1V0DS
17
PD168001
[MEMO]
18
Data Sheet S15728EJ1V0DS
PD168001
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet S15728EJ1V0DS
19
PD168001
* The information in this document is current as of March, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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